[gta02-core] Openmoko Beagle Hybrid
Dr. H. Nikolaus Schaller
hns at goldelico.com
Thu Jun 17 09:04:24 CEST 2010
Am 16.06.2010 um 21:51 schrieb Joerg Eesmann:
> Hi Nikolaus,
> Very good stuff, an open phone with OMAP3530-Power, my dream...
> I am a little off topic here, but I take the chance to ask eitherway.
> I am thinking about a little simpler NaviBoard.
> The actual Naviboard has 2x2 ADC with I2C and one 2axis Gyro(analogue)
> and one 1-axis gyro(analogue). A few weeks ago Sparkfun announced a new
> 3-axis gyro with I2C (IDG3200), which would make the Naviboard much
> simpler, I guess, and give the chance to add the pressure sensor
> (BMP085) to the PCB.
These are interesting chips.
To disclose a top secret: the OM Beagle Hybrid also has space for up to 1x ITG-3200, 2x LIS302, 1x HMC5843, 1x LSM303 (redundancy), and 1x BMP085, all connected to I2C2 of the BeagleBoard. In addition to the TSC2007 and a Wi2Wi GPS module. Let's cross fingers that at least some of them work :)
> I have one of these gyro on a breakoutboard in my hands, the chip is
> really tiny with a tiny tiny footprint.
> I think I will be able to solder the pressure sensor with a reflow oven
> in future (when my reflow oven is finished), but this gyro and the
> honeywell mangneto sensor. How do I solder them?
> How do I apply the solder paste to such a fine grid with no special
> You said, you also have at least one chip with BGA (0.5 pitch I guess)
> on your board, how did you manage to solder this during prototyping?
> Any tipps?
Christoph has already described one method that can be applied during prototyping.
For the Beagle Hybrid, we did go to our SMD company and they have equipment to solder that for single parts. I don't know exactly how they do it, but it could be something like this machine:
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