<div dir="ltr">Btw. - this telit chipsets look really nice.<br>E.g. HSDPA 7.2 Mbit in about the same dimensions (only thicker) then the mc75i, datasheets available:<br><a href="http://www.telit.com/en/products/umts-hsdpa.php?p_id=14&p_ac=show&p=13">http://www.telit.com/en/products/umts-hsdpa.php?p_id=14&p_ac=show&p=13</a><br>
Maye to be considered for a future device?<br><br><div class="gmail_quote">On Tue, Aug 12, 2008 at 10:09 PM, Patryk Szymczak <span dir="ltr"><<a href="mailto:patryk.szymczak@gmail.com">patryk.szymczak@gmail.com</a>></span> wrote:<br>
<blockquote class="gmail_quote" style="border-left: 1px solid rgb(204, 204, 204); margin: 0pt 0pt 0pt 0.8ex; padding-left: 1ex;"><div class="Ih2E3d">> The dimensions it states is, that it's a 35x35x3.5mm package (a announcement<br>
> about the MC75i said, that it's using the same package) - compared to the<br>
> current 2-chip solution from TI (10x10 + 7x7) this takes up at least 6 times<br>
> the space.<br>
<br>
</div>Uhm, not possible. Telit GE864 is probably one of the smallest<br>
possible modules with its 30 x 30 x 2.8 mm.<br>
<a href="http://www.telit.com/en/products/gsm-gprs.php?p_id=12&p_ac=show&p=11" target="_blank">http://www.telit.com/en/products/gsm-gprs.php?p_id=12&p_ac=show&p=11</a><br>
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