No subject

BOTTOM: components + routing
L7: ground (less strict)
L6: routing + ground
L5: ground (strict) ??
L4: (power routing ?)
L3: ground (strict) ??
L2: power
TOP: components, routing


> 
>> I also think we can do it with a 6-layer, as long as we can use
>> buried and blind vias.
> 
> Blind vias should be no problem. I would try to avoid buried vias
> if we can. Not only because they may make the board harder to
> manufacture, but also because they effectively hide a trace from
> measurements.

Current design has many. Not sure we can avoid buried vias at all.

Álvaro